Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2679143
Kind Code:
B2
Inventors:
Hirakawa Noboru
Application Number:
JP20991688A
Publication Date:
November 19, 1997
Filing Date:
August 23, 1988
Export Citation:
Assignee:
NEC
International Classes:
H01L21/768; H01L21/76; (IPC1-7): H01L21/76; H01L21/768
Domestic Patent References:
| JP6222452A | ||||
| JP6392028A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)