Title:
【発明の名称】ICカードの製造方法
Document Type and Number:
Japanese Patent JP2687661
Kind Code:
B2
Abstract:
In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.
Inventors:
Kobayashi Makoto
Small Dai Shojiro
Small Dai Shojiro
Application Number:
JP7829590A
Publication Date:
December 08, 1997
Filing Date:
March 26, 1990
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B42D15/10; G06K19/077; H01L29/06; (IPC1-7): B42D15/10
Domestic Patent References:
| JP257397A | ||||
| JP1152098A | ||||
| JP1145197A | ||||
| JP199892A | ||||
| JP63185688A |
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)