Title:
【発明の名称】パッケージモジュール基板
Document Type and Number:
Japanese Patent JP2692522
Kind Code:
B2
Inventors:
Mita Mamoru
Kumakura Toyohiko
Takashiro Shoji
Ryuji Yonemoto
Kenji Yamaguchi
Kumakura Toyohiko
Takashiro Shoji
Ryuji Yonemoto
Kenji Yamaguchi
Application Number:
JP2658793A
Publication Date:
December 17, 1997
Filing Date:
February 16, 1993
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H05K1/14; H05K1/18; H05K3/36; (IPC1-7): H05K1/14; H05K1/18
Domestic Patent References:
| JP28167U |
Attorney, Agent or Firm:
Watanabe Noboru Minoru