Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2706162
Kind Code:
B2
Inventors:
Shigeki Komori
Takashi Kuroi
Takashi Kuroi
Application Number:
JP32230089A
Publication Date:
January 28, 1998
Filing Date:
December 11, 1989
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/76; H01L21/265; H01L21/336; H01L29/78; (IPC1-7): H01L29/78; H01L21/336; H01L21/76
Domestic Patent References:
| JP4969094A | ||||
| JP5066181A | ||||
| JP1114078A | ||||
| JP2276274A | ||||
| JP587837A |
Attorney, Agent or Firm:
Kenichi Hayase