Title:
【発明の名称】ブリッジ・メタル構造物を持つダイを有する半導体ウェーハおよびその製造方法
Document Type and Number:
Japanese Patent JP2724707
Kind Code:
B2
Inventors:
NEISAN ZOMAA
Application Number:
JP4988687A
Publication Date:
March 09, 1998
Filing Date:
March 04, 1987
Export Citation:
Assignee:
IKUSHISU CORP
International Classes:
H01L29/41; H01L29/06; H01L29/86; H01L29/861; H01L29/92; (IPC1-7): H01L29/06; H01L29/86; H01L29/861; H01L29/92
Domestic Patent References:
| JP6112069A | ||||
| JP6021567A | ||||
| JP58137228A | ||||
| JP56161342U |
Attorney, Agent or Firm:
Yuzo Yamazaki (1 person outside)