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Title:
【発明の名称】温度特性補償回路
Document Type and Number:
Japanese Patent JP2727389
Kind Code:
B2
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Inventors:
NIRAZUKA KIMITOSHI
SHIRAI NORIAKI
Application Number:
JP18525892A
Publication Date:
March 11, 1998
Filing Date:
July 13, 1992
Export Citation:
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Assignee:
FUJITSU KK
International Classes:
G01D3/028; G05D23/24; H03F1/30; (IPC1-7): G01D3/028; G05D23/24; H03F1/30
Domestic Patent References:
JP2202208A
Attorney, Agent or Firm:
Seiichi Samukawa



 
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