【発明の名称】コンダクターロールの製造方法

Title:

【発明の名称】コンダクターロールの製造方法

Document Type and Number:

Japanese Patent JP2728254

Kind Code:

B2

More Like This:

JP2001226796	COPPER FOIL FOR LASER DRILLING PROCESS, COPPER FOIL FITTED WITH RESIN USING SAME AND THEIR PRODUCING METHOD
JPWO2007007870	Blackened surface-treated copper foil and its blackened surface-treated copper foil for the front panel of plasma displays.

Inventors:

HARADA YOSHIO
OKA TAKASHI
TAKEUCHI JUNICHI

Application Number:

JP2208588A

Publication Date:

March 18, 1998

Filing Date:

February 03, 1988

Export Citation:

Assignee:

TOOKARO KK

International Classes:

C25D7/06; C23C4/02; C23C4/06; C23C4/12; C23C4/18; C25D21/00; (IPC1-7): C23C4/12; C23C4/02; C23C4/18; C25D7/06; C25D21/00

Domestic Patent References:

Attorney, Agent or Firm:

Junzo Ogawa (1 person outside)

Previous Patent: 鋸盤

Next Patent: 帯鋸盤における切込み制御装置