Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
【発明の名称】半導体素子収納用パッケージの製造方法
Document Type and Number:
Japanese Patent JP2728565
Kind Code:
B2
Inventors:
加治佐 定
Application Number:
JP41154190A
Publication Date:
March 18, 1998
Filing Date:
December 17, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOSERA KK
International Classes:
H01L23/12; (IPC1-7): H01L23/12
Domestic Patent References:
JP62123745A