Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2737256
Kind Code:
B2
Inventors:
TOMINAGA MAKOTO
Application Number:
JP15163689A
Publication Date:
April 08, 1998
Filing Date:
June 13, 1989
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/30; H01L21/027; H01L21/301; H01L21/78; (IPC1-7): H01L21/301; H01L21/027
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)