Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2740177
Kind Code:
B2
Inventors:
Toshiyuki Oh Furuta
Application Number:
JP885888A
Publication Date:
April 15, 1998
Filing Date:
January 19, 1988
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L29/73; H01L21/331; H01L21/822; H01L21/8222; H01L27/04; H01L27/06; H01L29/72; H01L29/732; (IPC1-7): H01L21/8222; H01L27/06
Domestic Patent References:
| JP6113656A | ||||
| JP5954257A | ||||
| JP6038853A | ||||
| JP5685848A |
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)