Title:
【発明の名称】電気的装置
Document Type and Number:
Japanese Patent JP2769491
Kind Code:
B2
Abstract:
A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.
Inventors:
Benjamin H. Cranston
Lloyd Shepherd
Lloyd Shepherd
Application Number:
JP32939189A
Publication Date:
June 25, 1998
Filing Date:
December 19, 1989
Export Citation:
Assignee:
American Telephone and Telegraph Campany
International Classes:
C08L63/00; C08L83/04; H01B5/00; H01B5/16; H01B13/00; H01L21/52; H01R4/02; H01R11/01; H05K3/32; (IPC1-7): H01B5/16; H01B5/00; H01B13/00; H01L21/52; H01R11/01
Domestic Patent References:
| JP6410508A | ||||
| JP1195607A | ||||
| JP62229713A | ||||
| JP63110506A | ||||
| JP61243611A | ||||
| JP6286011U |
Attorney, Agent or Firm:
Hirofumi Mimata