【発明の名称】半導体装置

Title:

【発明の名称】半導体装置

Document Type and Number:

Japanese Patent JP2776569

Kind Code:

B2

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Inventors:

MISU KAZUHITO

Application Number:

JP17744089A

Publication Date:

July 16, 1998

Filing Date:

July 10, 1989

Export Citation:

Assignee:

NIPPON DENKI KK

International Classes:

H01L27/04; H01L21/822; H01L21/8234; H01L27/088; H01L29/78; (IPC1-7): H01L29/78; H01L21/822; H01L21/8234; H01L27/04; H01L27/088

Domestic Patent References:

Attorney, Agent or Firm:

Naoki Kyomoto

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