Title:
【発明の名称】半導体処理装置及び方法並びに半導体処理装置モジュール
Document Type and Number:
Japanese Patent JP2791251
Kind Code:
B2
Abstract:
A semiconductor processing method includes the steps of carrying a case containing semiconductor wafers and to which an ID card is attached into semiconductor processing equipment at a first side of the semiconductor processing equipment; removing the ID card from the case; taking the semiconductor wafers out of the case; carrying the semiconductor wafers taken out of the case into a processing means on a second side, opposite to the first side, of the semiconductor processing equipment; processing the semiconductor wafers in the processing means; attaching the ID card corresponding to the semiconductor wafers to the case; taking the processed semiconductor wafers out of the processing means at the first side of the semiconductor processing equipment; putting the processed semiconductor wafers into the case to which the ID card is attached; and carrying the case outside the semiconductor equipment at the first side of the semiconductor equipment.
Inventors:
YAMADA YOSHIAKI
IWASAKI JUNJI
OOMORI MASASHI
IWASAKI JUNJI
OOMORI MASASHI
Application Number:
JP20406892A
Publication Date:
August 27, 1998
Filing Date:
July 30, 1992
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
H01L21/02; H01L21/00; H01L21/304; H01L21/677; (IPC1-7): H01L21/68; H01L21/02; H01L21/304
Domestic Patent References:
| JP56164522A | ||||
| JP3218650A | ||||
| JP61228610A |
Attorney, Agent or Firm:
Soga Doteru (6 people outside)