Title:
【発明の名称】半導体封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP2795546
Kind Code:
B2
Inventors:
ITO HIROMI
KANEGAE JUZO
KANEGAE JUZO
Application Number:
JP2212891A
Publication Date:
September 10, 1998
Filing Date:
February 15, 1991
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
C08G59/20; C08G59/00; C08G59/30; C08G77/38; C08L63/00; C08L83/06; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08L83/06; H01L23/29; H01L23/31
Domestic Patent References:
| JP491156A |
Attorney, Agent or Firm:
Sota Asahina (1 person outside)