Title:
【発明の名称】エポキシコンポジットを用いた樹脂封止半導体装置
Document Type and Number:
Japanese Patent JP2804327
Kind Code:
B2
Inventors:
Hiroki Hirayama
Application Number:
JP33819789A
Publication Date:
September 24, 1998
Filing Date:
December 28, 1989
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
C08L63/00; C08G59/00; C08G59/62; C08K5/54; C08K5/5419; C08K5/544; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08G59/62; C08K5/54; C08L63/00; H01L23/31
Domestic Patent References:
| JP63245948A |
Attorney, Agent or Firm:
Mamoru Shimizu (1 person outside)