Title:
【発明の名称】樹脂封止型半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP2806328
Kind Code:
B2
Abstract:
In a plastic encapsulated semiconductor device, there is used a lead frame including an island for bearing thereon a semiconductor chip, a number of terminal leads extending outwardly from a proximity of the island, a pair of wing leads extending outwardly from a pair of opposite short-sides of the island. The wing leads are not coupled with tie-bars of the lead frame, and are positioned in a plane lower in level than a plane of the terminal leads. With this arrangement, even if pitch of the terminal leads is narrowed, the wing leads can be made not to interfere interfering with the terminal leads.
Inventors:
Kenichi Kurihara
Application Number:
JP28354295A
Publication Date:
September 30, 1998
Filing Date:
October 31, 1995
Export Citation:
Assignee:
NEC
International Classes:
H01L23/50; H01L23/495; (IPC1-7): H01L23/50
Domestic Patent References:
| JP5291473A | ||||
| JP5218263A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)