Title:
【発明の名称】電子部品実装装置
Document Type and Number:
Japanese Patent JP2808824
Kind Code:
B2
More Like This:
| JPH0541641 | [Name of the device] Assembly parts |
Inventors:
NAGAO KAZUHIDE
Application Number:
JP12848690A
Publication Date:
October 08, 1998
Filing Date:
May 17, 1990
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
B23P21/00; H05K13/00; H05K13/04; (IPC1-7): H05K13/00
Domestic Patent References:
| JP1298800A | ||||
| JP1184504A | ||||
| JP234997A |
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)