Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
【発明の名称】半田用チップおよびその製造方法
Document Type and Number:
Japanese Patent JP2819183
Kind Code:
B2
Inventors:
Hiroshi Yoshimura
Application Number:
JP12182490A
Publication Date:
October 30, 1998
Filing Date:
May 10, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hakuko Co., Ltd.
International Classes:
B23K3/02; (IPC1-7): B23K3/02
Domestic Patent References:
JP1321074A
JP5881562A
JP1309780A
JP62193961U
JP5123528U
JP5123527U
Attorney, Agent or Firm:
Fukushima Mitsuo



 
Previous Patent: 移送装置

Next Patent: 低刺激性洗浄剤組成物