Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2821363
Kind Code:
B2
Inventors:
Akiko Yamaguchi
Application Number:
JP6170094A
Publication Date:
November 05, 1998
Filing Date:
March 30, 1994
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
G06F11/22; G06F1/06; (IPC1-7): G06F11/22; G06F1/06
Domestic Patent References:
| JP4169878A | ||||
| JP6194131A | ||||
| JP3263152A | ||||
| JP62139051A | ||||
| JP6235930A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)