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Patent Searching and Data


Title:
【発明の名称】物質を流体の流れにさらす方法
Document Type and Number:
Japanese Patent JP2868778
Kind Code:
B2
Abstract:
PCT No. PCT/GB88/00887 Sec. 371 Date Apr. 23, 1990 Sec. 102(e) Date Apr. 23, 1990 PCT Filed Oct. 18, 1988 PCT Pub. No. WO89/03968 PCT Pub. Date May 5, 1989.Apparatus is provided for subjecting matter to fluid flow. The apparatus comprises a chamber (10) having an annular fluid inlet (14) beneath a first annular region (22) in the chamber. A second annular region (24) is contiguous with and disposed outwardly of the region (22) between the region (22) and a circumferential wall (12), which has a slope (18) towards the annular inlet (14). Means shown as an annular array of radially extending slots provided in an annular wall portion (FIG. 3) direct fluid through the inlet (14) with vertical and circumferential flow components. In use matter in the chamber is moved in a band continuously along an annular path in the regions. (22, 24). The matter is moved vertically and circumferentially while in the region (22) by the flow therein, is moved out of this flow into region (24) by circumferential force and is directed back into the region (22) by the slope (18) as indicated by arrows (30). Thus the matter is not continuously subjected to the fluid flow while being moved in its annular path in the chamber (10).

Inventors:
DOTSUDOSON KURISUTOFUAA EDOWAADO
Application Number:
JP50843888A
Publication Date:
March 10, 1999
Filing Date:
October 18, 1988
Export Citation:
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Assignee:
TOOFUTETSUKU LTD
International Classes:
B01J8/14; B01J8/32; B01J8/18; F27B15/00; F27B15/10; (IPC1-7): F27B15/10
Domestic Patent References:
JP57117335A
JP59180278A
JP6218215B2
JP6235810B2
JP5635891B1
Attorney, Agent or Firm:
Masao Okabe (5 others)