Title:
【発明の名称】弾性表面波デバイス
Document Type and Number:
Japanese Patent JP2872056
Kind Code:
B2
Abstract:
A surface acoustic wave (SAW) device in accordance with the present invention is constituted in such a way that a SAW device chip 2 in which electrode patterns are formed is accommodated within a package composed of a ceramic board 1 and a metallic cap 4. The SAW device comprises metallic patterns 5a and 5b provided at the ceramic board 1 as input/output terminals of the package and having convex portions 6a and 6b connected electrically to bonding pads 8a and 8b of a SAW device chip, respectively, and an elastic body 3 arranged between the metallic cap 4 and the SAW device chip 2. The SAW device chip 2 is fixed such that the bonding pads 8a and 8b are pushed against the convex portions 6a and 6b under a predetermined contact pressure by elastic force of the elastic body 3.
Inventors:
SAKAIRI NATSUHIKO
Application Number:
JP30221694A
Publication Date:
March 17, 1999
Filing Date:
December 06, 1994
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H03H9/25; H03H9/05; (IPC1-7): H03H9/25
Domestic Patent References:
| JP456510A | ||||
| JP661779A | ||||
| JP4293311A | ||||
| JP6326153A | ||||
| JP555303A | ||||
| JP563498A | ||||
| JP444733U | ||||
| JP54619U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)