Title:
【発明の名称】ワイヤボンディング装置
Document Type and Number:
Japanese Patent JP2877771
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the shape variation and imperfect connection of connecting ends of wires by making the pressing loads applied to the wires at the time of bonding the wires to a semiconductor chip directly detectable. SOLUTION: A wire bonding device is constituted so that a heater plate 32 can be provided on a heater block 31 incorporating a heater and wires can be connected to the connecting points of a semiconductor chip S by pressing the wires against the chip S with a capillary 14. A mounting hole 31a is formed in the block 31 and a pressure sensor 51 which detects the pressing load applied to a wire from the deformation of the block 31 is housed in the hole 31a by means of a pre-loading mechanism 40 while the sensor 51 is brought into contact with the internal surface of the hole 31a. Then the sensor 51 is connected to a controller 19 so that the controller 19 can control the vertical movement of the capillary 14 based on the output of the sensor 51.
Inventors:
MATSUMURA KATSUHIRO
Application Number:
JP27859096A
Publication Date:
March 31, 1999
Filing Date:
October 01, 1996
Export Citation:
Assignee:
KAIJOO KK
International Classes:
H01L21/60; H01L21/603; (IPC1-7): H01L21/60; H01L21/603
Domestic Patent References:
| JP7263481A | ||||
| JP641136U | ||||
| JP1112436U |
Attorney, Agent or Firm:
Minoru Yakushi (1 person outside)