Title:
【発明の名称】搭載用凹部を有する電子部品搭載用基板
Document Type and Number:
Japanese Patent JP2881264
Kind Code:
B2
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Inventors:
MORI MASAHIRO
TAKEYAMA TAKESHI
TAKEYAMA TAKESHI
Application Number:
JP40870590A
Publication Date:
April 12, 1999
Filing Date:
December 28, 1990
Export Citation:
Assignee:
IBIDEN KK
International Classes:
H01L25/18; H01L25/04; H05K1/18; H05K3/40; (IPC1-7): H01L25/04; H01L25/18
Attorney, Agent or Firm:
Hironori Takenori