Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2884787
Kind Code:
B2
Inventors:
ENJO YOSHIHIRO
Application Number:
JP1724991A
Publication Date:
April 19, 1999
Filing Date:
February 08, 1991
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L29/10; H01L29/78; (IPC1-7): H01L29/78
Domestic Patent References:
| JP62200766A | ||||
| JP3175679A | ||||
| JP1117363A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)