Title:
【発明の名称】セラミックパッケージの封止構造
Document Type and Number:
Japanese Patent JP2889519
Kind Code:
B2
More Like This:
| JPS55153360 | GLASS SEALING TYPE SEMICONDUCTOR DEVICE |
Inventors:
OOBA AKIRA
KAWAGUCHI HIDEYO
KAWAGUCHI HIDEYO
Application Number:
JP29388495A
Publication Date:
May 10, 1999
Filing Date:
November 13, 1995
Export Citation:
Assignee:
SUMITOMO KINZOKU EREKUTORO DEBAISU KK
International Classes:
H01L23/02; H01L23/08; (IPC1-7): H01L23/02; H01L23/08
Domestic Patent References:
| JP62101051A | ||||
| JP5917271A | ||||
| JP4121744U | ||||
| JP361343U |
Attorney, Agent or Firm:
Makoo Kako