【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2890532

Kind Code:

B2

Inventors:

SHIMOMURA HIROSHI
KAMEYAMA SHUICHI
KIKUCHI KAZUYA

Application Number:

JP26646489A

Publication Date:

May 17, 1999

Filing Date:

October 13, 1989

Export Citation:

Assignee:

MATSUSHITA DENKI SANGYO KK

International Classes:

H01L29/73; H01L21/331; H01L21/8249; H01L27/06; H01L29/732; (IPC1-7): H01L21/8249; H01L21/331; H01L27/06; H01L29/73

Attorney, Agent or Firm:

Fumio Iwahashi (2 others)

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