Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2895553
Kind Code:
B2
Inventors:
OCHIAI TOSHUKI
UCHAMA AKIRA
UCHAMA AKIRA
Application Number:
JP3911590A
Publication Date:
May 24, 1999
Filing Date:
February 20, 1990
Export Citation:
Assignee:
OKI DENKI KOGYO KK
International Classes:
H01L29/78; (IPC1-7): H01L29/78
Domestic Patent References:
| JP63296376A |
Attorney, Agent or Firm:
Takashi Ogaki