Title:
【発明の名称】電子部品用接着テープ
Document Type and Number:
Japanese Patent JP2896752
Kind Code:
B2
Abstract:
PURPOSE: To obtain an adhesive tape desirable in the production of semiconductor devices by laying semi-cured adhesive layers which have different degrees of curing and each of which comprises a specified-group-containing butadiene/ acrylonitrile copolymer and a specified maleimide compound on a release tape. CONSTITUTION: At least two semi-cured layers which have different degrees of curing and each of which is prepared by making a liquid adhesive comprising a piperazinylethylaminocarbonyl-containing butadiene/acrylonitrile copolymer (a) having a weight-average molecular weight of 1000-50000 and an acrylonitrile content of 5-50wt.% and represented by formula I (wherein m=50-95; and n=5-50) and 10-900 pts.wt., per 100 pts.wt. (a), compound (b) having at least two maleimide groups (e.g. a compound of formula II) and curing this adhesive to stage B are laid on either surface of a release film. It is desirable that the at least two layers have specified slip rates. This tape does not suffer from e.g. a problem that the end of a lead frame penetrates the adhesive layer when used in the production of semiconductor devices.
Inventors:
SAKUMOTO YUKINORI
HASHIMOTO TAKESHI
NISHIGAYA TAKESHI
YAMANASHI FUMYOSHI
HASHIMOTO TAKESHI
NISHIGAYA TAKESHI
YAMANASHI FUMYOSHI
Application Number:
JP9591895A
Publication Date:
May 31, 1999
Filing Date:
March 30, 1995
Export Citation:
Assignee:
TOMOEGAWA SEISHIJO KK
International Classes:
C09J7/00; C08F220/60; C08F279/00; C08F279/02; C08G73/00; C08G77/26; C09J7/02; C09J109/02; C09J121/00; C09J133/02; C09J133/20; C09J133/24; H01L21/52; H01L23/40; (IPC1-7): C09J7/02; C08F220/60; C08F279/02; C08G73/00; C08G77/26; C09J109/02; C09J133/20; H01L21/52; H01L23/40
Domestic Patent References:
| JP8269405A | ||||
| JP7126592A | ||||
| JP7126591A | ||||
| JP6259678A |
Attorney, Agent or Firm:
Tsuyoshi Watanabe (1 person outside)