Title:
【発明の名称】樹脂封止型半導体装置の不要樹脂除去装置
Document Type and Number:
Japanese Patent JP2901694
Kind Code:
B2
More Like This:
Inventors:
YANAGISAWA SADAO
Application Number:
JP9269690A
Publication Date:
June 07, 1999
Filing Date:
April 07, 1990
Export Citation:
Assignee:
APITSUKU YAMADA KK
International Classes:
H01L21/56; B29C45/38; B29L31/34; (IPC1-7): B29C45/38; H01L21/56
Domestic Patent References:
| JP1304758A | ||||
| JP58160129A | ||||
| JP60217100A | ||||
| JP1304758A | ||||
| JP1258926A | ||||
| JP2165925A | ||||
| JP6088542U |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)