Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2913500
Kind Code:
B2
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Inventors:
OOTSUKA KOJI
Application Number:
JP34288693A
Publication Date:
June 28, 1999
Filing Date:
December 14, 1993
Export Citation:
Assignee:
SANKEN DENKI KK
International Classes:
H01L23/28; H01L23/12; H01L23/48; (IPC1-7): H01L23/12; H01L23/28; H01L23/48
Domestic Patent References:
| JP442739U |
Attorney, Agent or Firm:
Takano Noritsuji