Title:
【発明の名称】半導体装置の配線構造
Document Type and Number:
Japanese Patent JP2919207
Kind Code:
B2
Inventors:
TOBA TSUNEO
Application Number:
JP32637192A
Publication Date:
July 12, 1999
Filing Date:
December 07, 1992
Export Citation:
Assignee:
NIPPON DENKI AISHII MAIKON SHISUTEMU KK
International Classes:
H01L21/82; H01L21/3205; (IPC1-7): H01L21/82; H01L21/3205
Domestic Patent References:
| JP6439042A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)