Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2925960
Kind Code:
B2
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Inventors:
INABA JUICHI
Application Number:
JP29534394A
Publication Date:
July 28, 1999
Filing Date:
November 29, 1994
Export Citation:
Assignee:
SANYO DENKI KK
International Classes:
H01L23/29; H01L21/302; H01L21/3065; H01L21/56; H01L23/31; (IPC1-7): H01L23/29; H01L21/3065; H01L21/56; H01L23/31
Domestic Patent References:
| JP6190437A |
Attorney, Agent or Firm:
Kei Okada