Title:
【発明の名称】基板加熱装置
Document Type and Number:
Japanese Patent JP2927857
Kind Code:
B2
Abstract:
An improved substrate heating apparatus for use in a low-pressure CVD technique is provided. The apparatus comprises a substrate fixing member whose surface is coated with a heat reflector that reflects heat generated by a substrate heater. By virtue of this heat reflector, the surface temperature of the substrate fixing member can be maintained significantly lower than that of a substrate to be processed. Thus undesirable, thin film deposition on the surface of the substrate fixing member can be effectively suppressed. As a result, wasteful material gas consumption can be minimized, and the rate of forming thin films on the substrate surface can be held substantially constant.
Inventors:
NAKADA RENPEI
Application Number:
JP822690A
Publication Date:
July 28, 1999
Filing Date:
January 19, 1990
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
C23C16/458; C23C16/46; C30B25/10; F27B17/00; H01L21/205; H01L21/31; (IPC1-7): C23C16/46; H01L21/205; H01L21/31
Attorney, Agent or Firm:
Hideaki Tokawa (1 outside)