Title:
【発明の名称】鋳型アセンブリ
Document Type and Number:
Japanese Patent JP2940989
Kind Code:
B2
Abstract:
A device for aiding in the assembly of a mold apparatus of the type including a mold cavity having a first side which is contoured to impart a shape to a component, a second side, and an aperture extending between the first and second sides, and of the type including an ejector pin positioned adjacent the second side, the ejector pin having an end positioned to move into the aperture to become a portion of a surface including the first side when the mold assembly is assembled, and positioned to effect movement of the component away from the mold cavity after the component is imparted with the shape, the device including an assembly pin having an end positioned to pass through the aperture, and a sleeve having a first portion positioned to slide onto the end of one of the ejector pins and to support itself on the end of the ejector pin and having a second portion protruding from the end of the ejector pin to receive therein the end of the assembly pin in axial alignment with the ejector pin in the sleeve.
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Inventors:
RATSUSERU JEI UANRENSU
Application Number:
JP9200290A
Publication Date:
August 25, 1999
Filing Date:
April 06, 1990
Export Citation:
Assignee:
AUTOBOODO MAARIN CORP
International Classes:
B22C9/02; B22C9/04; B22C9/06; B22D29/04; B29C33/30; B29C33/44; B29C44/34; (IPC1-7): B22C9/06; B22C9/04; B22D29/04
Attorney, Agent or Firm:
Jun Tsuda (3 others)