Title:
【発明の名称】プラズマ処理装置
Document Type and Number:
Japanese Patent JP2947380
Kind Code:
B2
Abstract:
A plasma processing apparatus for etching, ashing, or otherwise processing silicon wafers has a pair of spaced reaction chambers each for processing a silicon wafers in a plasma, a pair of spaced cassette table mechanisms each for supporting a wafer cassette which houses a plurality of wafers therein, and a transfer robot disposed between the pair of spaced reaction chambers and the pair of spaced cassette table mechanisms, for transferring the wafers, one at a time, between the wafer cassette supported by one of the workpiece table mechanisms and one of the reaction chambers. Each of the cassette table mechanisms has a turntable for placing the wafer thereon, the turntable being rotatable to orient the wafer cassette out of physical interference with the robot arm of the transfer robot.
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Inventors:
UEHARA AKIRA
MINATO MITSUAKI
KAWAMURA YOSHIJI
MINATO MITSUAKI
KAWAMURA YOSHIJI
Application Number:
JP3145392A
Publication Date:
September 13, 1999
Filing Date:
January 22, 1992
Export Citation:
Assignee:
TOKYO OKA KOGYO KK
International Classes:
B25J9/04; B65G49/07; C23C14/56; C23F4/00; C30B25/12; H01L21/677; (IPC1-7): H01L21/68; B25J9/04; C23C14/56; C23F4/00; C30B25/12
Domestic Patent References:
| JP62290616A | ||||
| JP58108641A | ||||
| JP61107735A | ||||
| JP3161161A | ||||
| JP327049U | ||||
| JP282032U | ||||
| JP6291439U |
Attorney, Agent or Firm:
Yu Koyama