【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2951319

Kind Code:

B2

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Inventors:

TAKEUCHI KUNIO
FURUICHI SHINJI
MIZUHARA HIDEKI
AKIZUKI MAKOTO
AOE HIROYUKI

Application Number:

JP17294898A

Publication Date:

September 20, 1999

Filing Date:

June 19, 1998

Export Citation:

Assignee:

SANYO DENKI KK

International Classes:

H01L21/28; H01L21/20; H01L29/423; H01L29/43; H01L29/49; H01L29/78; (IPC1-7): H01L29/78; H01L21/20; H01L21/28; H01L29/43

Domestic Patent References:

JP2298074A

Attorney, Agent or Firm:

Koji Yasutomi (1 person outside)

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