【発明の名称】半導体装置

Title:

【発明の名称】半導体装置

Document Type and Number:

Japanese Patent JP2971399

Kind Code:

B2

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Inventors:

SHIMIZU MITSURU
FUJII HIDETAKE
NUMATA KENJI
WADA MASAHARU

Application Number:

JP20206796A

Publication Date:

November 02, 1999

Filing Date:

July 31, 1996

Export Citation:

Assignee:

TOSHIBA KK
TOSHIBA MAIKURO EREKUTORONIKUSU KK

International Classes:

H01L27/04; H01L21/822; H01L21/8234; H01L27/088; (IPC1-7): H01L27/04; H01L21/822; H01L21/8234; H01L27/088

Domestic Patent References:

JP2119262A
JP5139065B1

Attorney, Agent or Firm:

Takehiko Suzue (6 outside)

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