Title:
【発明の名称】電線接続方法
Document Type and Number:
Japanese Patent JP2972838
Kind Code:
B2
Abstract:
A band (50) of bipartite metal foil is crimped around a portion of a stripped wire end (32) near the insulation and spaced from the portion to be soldered to a terminal solder tail (30) extending from a housing portion (14), with a first layer of conductive nonmagnetic metal and a thin second layer of high resistance metal having high magnetic permeability. When the wire end (32) is paired with the solder tail (30) with a solder preform placed therearound within a length of heat recoverable tubing (34) extending between the insulated wire portion and the housing (14) of the terminal (22), and high frequency alternating current is induced in the bipartite metal foil (50), thermal energy is generated which is conducted along the wire end and radiates outwardly to melt the solder to join the wire end to the solder tails and to shrink the tubing (34) to grip the insulated wire portion and housing portion to cover and seal the termination thus formed. A pair of wires can be similarly be spliced and sealed, with a bipartite metal foil band crimped around one of the wire ends able to generate thermal energy to melt a solder preform when appropriate current is induced therein.
Inventors:
JEIMUZU HOORU SHUROTSUTSU
Application Number:
JP25757790A
Publication Date:
November 08, 1999
Filing Date:
September 28, 1990
Export Citation:
Assignee:
AMUPU INC
International Classes:
H01R4/02; H01R4/72; H01R43/02; (IPC1-7): H01R4/72; H01R4/02; H01R43/02
Domestic Patent References:
| JP2239576A | ||||
| JP180420U |
Other References:
【文献】特許2724623(JP,B2)
【文献】特許2673728(JP,B2)
【文献】特許2673728(JP,B2)
Attorney, Agent or Firm:
Japan MPM Co., Ltd.