Title:
【発明の名称】ダイスタンピングプレス機用の自己レベリング式ダイプラテン
Document Type and Number:
Japanese Patent JP2975118
Kind Code:
B2
Abstract:
A self-leveling die platen assembly (32) is provided which includes a shiftable platen (78) which can rock as necessary to accommodate the configuration of a cooperating platen assembly (30). Preferably, the assembly (32) includes a stationary die shoe (46) provided with a fluid reservoir (50); a piston (68) is rockably received within reservoir (50) and supports the platen (78). During stamping or cutting operations, the platen (78) can thus move and self-adjust as necessary to accommodate the configuration of cooperating platen assembly (30). The self-adjusting assembly (32) greatly facilitates makeready operations.
Inventors:
SUKAAN JON TEII
Application Number:
JP52125096A
Publication Date:
November 10, 1999
Filing Date:
January 03, 1996
Export Citation:
Assignee:
PUREKO IND INC
International Classes:
B26F1/38; B26D7/26; B26F1/40; B30B15/00; B30B15/06; B31B50/25; B31F1/08; (IPC1-7): B31B1/25; B26F1/38; B31F1/08
Other References:
【文献】米国特許5195435(US,A)
【文献】米国特許4586413(US,A)
【文献】米国特許4586413(US,A)
Attorney, Agent or Firm:
Kuwahara Hideaki