Title:
【発明の名称】ボンディング方法
Document Type and Number:
Japanese Patent JP2978254
Kind Code:
B2
Abstract:
PURPOSE:To surely prevent that an object to be bonded is damaged. CONSTITUTION:After the feed operation of a lead frame 4 by using a conveyance mechanism 5 with reference to a bonding stage 1 and before the fixation operation of the lead frame 4 by using the bonding stage 1 and a lead retainer 2, its position is corrected by the fine movement of the conveyance mechanism 5 or the bonding stage 1 and the lead retainer 2. Thereby, it is possible to avoid the damage, of the lead frame 4, which is caused by its dislocation with reference to the bonding stage 1 and the lead retainer 2.
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Inventors:
KURODA AKIRA
OZAWA KUNIAKI
ISHIDA JUNICHI
NADAMOTO KEISUKE
OZAWA KUNIAKI
ISHIDA JUNICHI
NADAMOTO KEISUKE
Application Number:
JP1751491A
Publication Date:
November 15, 1999
Filing Date:
February 08, 1991
Export Citation:
Assignee:
HITACHI TOKYO EREKUTORONIKUSU KK
International Classes:
H01L21/50; H01L21/60; H01L21/68; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6147647A | ||||
| JP63142835U |
Attorney, Agent or Firm:
Yamato Tsutsui