Title:
【発明の名称】テ―プ形チップサイズパッケ―ジの製造方法、およびテ―プ形チップサイズパッケ―ジ
Document Type and Number:
Japanese Patent JP2983214
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To provide a tape-type CSP(chip size package) which is simplified in manufacturing process, lessened in fraction defective, and reduced in cost, by a method wherein solder balls can be firmly bonded to pads, and Ni/Au plating can be carried out through an electroless plating method. SOLUTION: A tape-type CSP is equipped with a bonding pad 10 provided to the surface of a copper foil 3 and solder ball pads 11 provided to the rear of the copper foil 3 and manufactured through a method where the rear of the copper foil 3 is plated with Sn 5 or the like before a step where a photoresist film is formed after the copper foil 3 is cleaned, and the rear of a resin tape 1 is lined with a masking material. When the surface of the copper foil 3 is also plated with Sn 5 or the like, a process where an Sn plating is removed is provided, and an Ni/Au plating 9 is carried out through an electroless plating method, and then the lining masking material provided to the rear of the resin tape 1 is separated off.
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Inventors:
OOTO SHIGETAKA
Application Number:
JP37742398A
Publication Date:
November 29, 1999
Filing Date:
December 28, 1998
Export Citation:
Assignee:
OOTO SHIGETAKA
International Classes:
H01L23/12; H01L21/60; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP10294394A | ||||
| JP10163371A | ||||
| JP1140620A |
Attorney, Agent or Firm:
Kiyoshi Kyoguchi