Title:
【発明の名称】樹脂封止型半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP2986788
Kind Code:
B1
Inventors:
MINAMIO MASANORI
ADACHI OSAMU
NOMURA TOORU
ADACHI OSAMU
NOMURA TOORU
Application Number:
JP29938998A
Publication Date:
December 06, 1999
Filing Date:
October 21, 1998
Export Citation:
Assignee:
MATSUSHITA DENSHI KOGYO KK
International Classes:
B21D28/00; B21D28/10; B29C45/14; H01L23/12; H01L23/28; H01L23/50; B29L31/34; (IPC1-7): H01L23/50; H01L23/12
Domestic Patent References:
| JP10256460A | ||||
| JP5129473A | ||||
| JP5780750A |
Attorney, Agent or Firm:
Fumio Iwahashi (1 person outside)