Title:
【発明の名称】半導体ウエハ切断装置における内周刃のドレッシング方法
Document Type and Number:
Japanese Patent JP2992250
Kind Code:
B2
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Inventors:
SATO SHIGEKI
SATO TSUTOMU
SATO TSUTOMU
Application Number:
JP15970897A
Publication Date:
December 20, 1999
Filing Date:
June 17, 1997
Export Citation:
Assignee:
NAOETSU DENSHI KOGYO KK
International Classes:
B24B53/00; (IPC1-7): B24B53/00
Domestic Patent References:
JP872052A | ||||
JP1109069A |
Attorney, Agent or Firm:
Masahaya Hayakawa (1 person outside)