Title:
【発明の名称】熱測定用集積半導体回路
Document Type and Number:
Japanese Patent JP2999227
Kind Code:
B2
Abstract:
Integrated semiconductor circuit for thermal measurements, comprising at least a temperature or a heat current sensor and a signal comparator (8), the comparator (8) being provided with a signal feedback loop containing a DA signal converter (3), more specifically, the comparator (8) being a temperature or a heat current comparator, the DA signal-converter (3) comprising a power output and the signal feedback loop comprising components for the transfer of thermal signals.
Inventors:
Johann Hendrick Huijing
Frank Robert Reed Dyke
Frank Robert Reed Dyke
Application Number:
JP16150690A
Publication Date:
January 17, 2000
Filing Date:
June 21, 1990
Export Citation:
Assignee:
Bronck Horst High Tech Beevey
International Classes:
G01F1/68; G01F1/696; G01F1/698; G01K17/04; G01K7/00; G01L21/10; G01N25/20; G08C13/00; (IPC1-7): G01K17/04; G01F1/68; G01K7/00; G01N25/20
Domestic Patent References:
| JP6279316A | ||||
| JP1147322A | ||||
| JP649318A | ||||
| JP61200433A | ||||
| JP5913359A | ||||
| JP6413419A | ||||
| JP57115044A | ||||
| JP63302320A | ||||
| JP1153912A | ||||
| JP1258449A | ||||
| JP5280192A | ||||
| JP170141U |
Other References:
【文献】国際公開89/3512(WO,A1)
Attorney, Agent or Firm:
Toru Fujioka