Title:
【発明の名称】窒化珪素粉末、窒化珪素焼結体及びそれを用いた回路基板
Document Type and Number:
Japanese Patent JP3002642
Kind Code:
B2
Inventors:
Hideki Hirotsuru
Ryuichi Terasaki
Yukihiko Nakajima
Ryuichi Terasaki
Yukihiko Nakajima
Application Number:
JP15916296A
Publication Date:
January 24, 2000
Filing Date:
May 31, 1996
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C04B35/584; C04B35/626; H05K1/03; (IPC1-7): C04B35/626; H05K1/03
Domestic Patent References:
| JP62297269A | ||||
| JP3290370A | ||||
| JP812306A | ||||
| JP8133842A | ||||
| JP834670A |