【考案の名称】成形装置の充填装置 - Heiwa Chemical Industry Co., Ltd.

Title:

【考案の名称】成形装置の充填装置

Document Type and Number:

Japanese Patent JP3013673

Kind Code:

U

Inventors:

Kazuyuki Hatakeyama

Application Number:

JP9695U

Publication Date:

July 18, 1995

Filing Date:

January 17, 1995

Export Citation:

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Assignee:

Heiwa Chemical Industry Co., Ltd.

International Classes:

(IPC1-7): B29C31/04; B29C31/02; B29C45/18; B29C45/20; B29C45/47

Domestic Patent References:

JP4045015B
JPH0592453A	1993-04-16
JPS644495U	1989-01-11

Attorney, Agent or Firm:

Minoru Nakamura (6 outside)

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