Title:
【発明の名称】半導体集積回路の製造方法
Document Type and Number:
Japanese Patent JP3036768
Kind Code:
B2
Inventors:
Kazuo Takeda
Teruo Tabata
Nobuyuki Sekikawa
Yoshiaki Sano
Teruo Tabata
Nobuyuki Sekikawa
Yoshiaki Sano
Application Number:
JP34081089A
Publication Date:
April 24, 2000
Filing Date:
December 28, 1989
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L29/73; H01L21/331; H01L21/8224; H01L21/8226; H01L21/8228; H01L27/082; H01L29/08; H01L29/732; (IPC1-7): H01L21/8228; H01L21/331; H01L21/8224; H01L27/082; H01L29/73
Domestic Patent References:
| JP5990957A | ||||
| JP5092686A | ||||
| JP62216356A | ||||
| JP5438775A | ||||
| JP63257261A |
Attorney, Agent or Firm:
Masamasa Shibano