Title:
【考案の名称】半導体素子の製造装置
Document Type and Number:
Japanese Patent JP3055714
Kind Code:
U
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Inventors:
Hideshi Shishido
Application Number:
JP510998U
Publication Date:
January 29, 1999
Filing Date:
July 10, 1998
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
(IPC1-7): H01L21/027
Attorney, Agent or Firm:
Shoji Shinobe