Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3064994
Kind Code:
B2
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Inventors:
Atsuki Ono
Application Number:
JP30025297A
Publication Date:
July 12, 2000
Filing Date:
October 31, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L21/76; H01L29/78; (IPC1-7): H01L21/76; H01L29/78
Domestic Patent References:
| JP215650A | ||||
| JP61252645A |
Attorney, Agent or Firm:
Yasuyuki Hata