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Patent Searching and Data


Title:
半導体装置
Document Type and Number:
Japanese Patent JP3070145
Kind Code:
B2
Inventors:
土屋 光司 (東京都品川区北品川6丁目7番35号  ソニー株式会社内)
Application Number:
JP17462291A
Publication Date:
July 24, 2000
Filing Date:
June 19, 1991
Export Citation:
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Assignee:
ソニー株式会社 (東京都品川区北品川6丁目7番35号)
International Classes:
H01L21/02; H01L21/52; H01L27/14; (IPC1-7): H01L27/14; H01L21/02; H01L21/52
Attorney, Agent or Firm:
船橋 國則